{"id":73,"date":"2022-06-29T00:38:56","date_gmt":"2022-06-29T00:38:56","guid":{"rendered":"https:\/\/divi.ameravant.com\/destination2d\/?page_id=73"},"modified":"2022-11-17T17:44:51","modified_gmt":"2022-11-18T01:44:51","slug":"technology","status":"publish","type":"page","link":"https:\/\/destination2d.com\/technology\/","title":{"rendered":"Technology"},"content":{"rendered":"<p>[et_pb_section fb_built=&#8221;1&#8243; disabled_on=&#8221;on|on|on&#8221; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; background_color=&#8221;#3a3a3a&#8221; background_image=&#8221;https:\/\/divi.ameravant.com\/destination2d\/wp-content\/uploads\/sites\/92\/2022\/08\/Integrated-Circuit.jpg&#8221; parallax=&#8221;on&#8221; min_height=&#8221;60vh&#8221; custom_padding=&#8221;15vh||15vh||true|false&#8221; disabled=&#8221;on&#8221; locked=&#8221;off&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_row _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8221;1&#8243; disabled_on=&#8221;off|off|off&#8221; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; custom_padding=&#8221;0px|||||&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_row _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; positioning=&#8221;absolute&#8221; position_origin_a=&#8221;center_center&#8221; z_index=&#8221;2&#8243; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text admin_label=&#8221;Text Overlay&#8221; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; text_line_height=&#8221;6.2em&#8221; header_text_align=&#8221;center&#8221; header_font_size=&#8221;2.5em&#8221; header_line_height=&#8221;1.2em&#8221; position_origin_a=&#8221;center_center&#8221; z_index=&#8221;2&#8243; background_layout=&#8221;dark&#8221; width=&#8221;100%&#8221; custom_margin=&#8221;||||false|false&#8221; custom_padding=&#8221;||||false|false&#8221; header_font_size_tablet=&#8221;2.5em&#8221; header_font_size_phone=&#8221;18px&#8221; header_font_size_last_edited=&#8221;on|phone&#8221; header_text_shadow_style=&#8221;preset5&#8243; global_colors_info=&#8221;{}&#8221;]<\/p>\n<h1><span>Faster, ultra reliable, and ultra energy-efficient graphene interconnects<\/span><\/h1>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; z_index=&#8221;1&#8243; width=&#8221;100%&#8221; max_width=&#8221;100%&#8221; height=&#8221;60vh&#8221; height_tablet=&#8221;60vh&#8221; height_phone=&#8221;60vh&#8221; height_last_edited=&#8221;on|phone&#8221; custom_padding=&#8221;0px|||||&#8221; custom_css_main_element=&#8221;overflow: hidden;&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_code admin_label=&#8221;Video Code&#8221; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;]<iframe loading=\"lazy\" data-src=\"https:\/\/player.vimeo.com\/video\/755300354?background=1\" src=\"https:\/\/player.vimeo.com\/video\/755300354?background=1\" class=\"auto_video vimeo_video lazyloaded\" id=\"vimeo-750455112\" width=\"500\" height=\"282\" frameborder=\"0\" allowfullscreen=\"\" mozallowfullscreen=\"\" webkitallowfullscreen=\"\"><\/iframe>[\/et_pb_code][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8221;1&#8243; _builder_version=&#8221;4.17.6&#8243; _module_preset=&#8221;default&#8221; custom_padding=&#8221;||4px|||&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_row column_structure=&#8221;2_5,3_5&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;2_5&#8243; _builder_version=&#8221;4.17.6&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; header_2_line_height=&#8221;1.5em&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<h2><b>Semiconductor industry\u2019s very first CMOS-compatible, low-temperature, 300mm-scale, graphene interconnect technology<\/b><\/h2>\n<p>[\/et_pb_text][et_pb_divider _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][\/et_pb_divider][et_pb_button button_url=&#8221;@ET-DC@eyJkeW5hbWljIjp0cnVlLCJjb250ZW50IjoicG9zdF9saW5rX3VybF9wYWdlIiwic2V0dGluZ3MiOnsicG9zdF9pZCI6IjgzIn19@&#8221; button_text=&#8221;Learn More&#8221; _builder_version=&#8221;4.18.0&#8243; _dynamic_attributes=&#8221;button_url&#8221; _module_preset=&#8221;default&#8221; custom_button=&#8221;on&#8221; button_text_color=&#8221;#0c71c3&#8243; button_bg_color=&#8221;#f4f4f4&#8243; global_colors_info=&#8221;{}&#8221; button_bg_color__hover_enabled=&#8221;on|hover&#8221; button_bg_color__hover=&#8221;#000000&#8243; button_bg_enable_color__hover=&#8221;on&#8221; button_text_color__hover_enabled=&#8221;on|hover&#8221; button_text_color__hover=&#8221;#FFFFFF&#8221;][\/et_pb_button][\/et_pb_column][et_pb_column type=&#8221;3_5&#8243; _builder_version=&#8221;4.17.6&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_image src=&#8221;https:\/\/divi.ameravant.com\/destination2d\/wp-content\/uploads\/sites\/92\/2022\/09\/bigstock-Silicon-Wafer-with-microchips-437484503.jpg&#8221; title_text=&#8221;Silicon Wafer with microchips used in electronics for the fabric&#8221; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; border_radii=&#8221;on|8px|8px|8px|8px&#8221; box_shadow_style=&#8221;preset1&#8243; global_colors_info=&#8221;{}&#8221;][\/et_pb_image][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8221;3_5,2_5&#8243; _builder_version=&#8221;4.17.6&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;3_5&#8243; _builder_version=&#8221;4.17.6&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<p><span style=\"font-weight: 400;\">State-of-the-art interconnect material copper (Cu) is running out of steam due to a <\/span><span style=\"font-size: 18px;\">non-linear increase in resistivity with scaling, which degrades performance, reliability, and energy-efficiency. The semiconductor industry is actively looking for a solution.<\/span><\/p>\n<p>[\/et_pb_text][et_pb_text _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<p><span style=\"font-weight: 400;\"><strong>Engineered graphene<\/strong> offers lower resistivity and up to 100-folds higher current-carrying capacity, compared to conventional Cu interconnects, leading to faster, more reliable, thinner, and more energy-efficient interconnects.<\/span><\/p>\n<p>[\/et_pb_text][et_pb_text _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<p><span style=\"font-weight: 400;\">For CMOS and related microelectronics applications, high-quality graphene must be directly deposited (transfer-free) on a variety of substrates including dielectrics and metal layers at back-end-of-line (BEOL) compatible temperatures (&lt;450 \u00b0C), which makes conventional graphene growth via chemical vapor deposition and other methods unsuitable since they require significantly higher temperatures.<\/span><\/p>\n<p>[\/et_pb_text][et_pb_text _builder_version=&#8221;4.19.0&#8243; _module_preset=&#8221;default&#8221; link_font=&#8221;|700|||on|||#222299|&#8221; hover_enabled=&#8221;0&#8243; global_colors_info=&#8221;{}&#8221; link_text_color=&#8221;#222299&#8243; sticky_enabled=&#8221;0&#8243;]<\/p>\n<p><span style=\"font-weight: 400;\">More information on interconnect scaling and graphene synthesis challenges can be found <\/span><a href=\"\/graphene-goes-mainstream\/\">here<\/a><\/p>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8221;2_5&#8243; _builder_version=&#8221;4.17.6&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_image src=&#8221;https:\/\/divi.ameravant.com\/destination2d\/wp-content\/uploads\/sites\/92\/2022\/09\/image-5.jpg&#8221; title_text=&#8221;image (5)&#8221; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; custom_margin=&#8221;30%||||false|false&#8221; border_radii=&#8221;on|10px|10px|10px|10px&#8221; global_colors_info=&#8221;{}&#8221;][\/et_pb_image][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8221;1_2,1_2&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;1_2&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_image src=&#8221;https:\/\/divi.ameravant.com\/destination2d\/wp-content\/uploads\/sites\/92\/2022\/09\/multi-layer-graphene.jpg&#8221; title_text=&#8221;Graphene,Sheets,,3d,Illustration.,Scientific,And,Nanotechnology,Background&#8221; align=&#8221;center&#8221; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; custom_margin=&#8221;||-1px|||&#8221; global_colors_info=&#8221;{}&#8221;][\/et_pb_image][et_pb_text _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; text_font=&#8221;|700|||||||&#8221; text_text_color=&#8221;#000000&#8243; text_orientation=&#8221;center&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<p>Multi-layer Graphene (MLG)<\/p>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8221;1_2&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; text_font=&#8221;|700|||||||&#8221; text_text_color=&#8221;#000000&#8243; custom_margin=&#8221;|||25%|false|false&#8221; custom_padding=&#8221;||15px||false|false&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<p><b>MLG Interconnects<\/b><\/p>\n<p>[\/et_pb_text][et_pb_image src=&#8221;https:\/\/divi.ameravant.com\/destination2d\/wp-content\/uploads\/sites\/92\/2022\/09\/graphene-interconnects.png&#8221; title_text=&#8221;graphene-interconnects&#8221; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; transform_scale=&#8221;115%|115%&#8221; transform_translate=&#8221;24px|-43px&#8221; transform_translate_linked=&#8221;off&#8221; width=&#8221;100%&#8221; global_colors_info=&#8221;{}&#8221;][\/et_pb_image][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; link_font=&#8221;|700|||on||||&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<p><span style=\"font-weight: 400;\">Destination 2D graphene can be directly synthesized on various substrates at BEOL- compatible temperatures through our innovative process technology and proprietary 300mm synthesis tool <strong>CoolC\u2122<\/strong>.<\/span><\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; background_color=&#8221;rgba(72,118,234,0.24)&#8221; width=&#8221;60%&#8221; border_radii=&#8221;off|15px|15px||&#8221; border_width_bottom=&#8221;2px&#8221; border_color_bottom=&#8221;#FFFFFF&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; background_enable_color=&#8221;off&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; text_text_color=&#8221;#031529&#8243; text_font_size=&#8221;32px&#8221; text_orientation=&#8221;center&#8221; background_layout=&#8221;dark&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<p><span style=\"font-weight: 400;\"><strong>CoolC\u2122<\/strong><\/span><\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8221;1_2,1_2&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; background_color=&#8221;RGBA(72,118,234,0.24)&#8221; width=&#8221;60%&#8221; width_tablet=&#8221;60%&#8221; width_phone=&#8221;90%&#8221; width_last_edited=&#8221;on|phone&#8221; border_radii=&#8221;off|||15px|15px&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;1_2&#8243; _builder_version=&#8221;4.18.0&#8243; 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_module_preset=&#8221;default&#8221; ul_text_color=&#8221;#031529&#8243; ul_font_size=&#8221;1.8rem&#8221; ul_line_height=&#8221;2em&#8221; ul_font_size_tablet=&#8221;1.8rem&#8221; ul_font_size_phone=&#8221;1.2rem&#8221; ul_font_size_last_edited=&#8221;on|phone&#8221; ul_line_height_tablet=&#8221;2em&#8221; ul_line_height_phone=&#8221;1.8em&#8221; ul_line_height_last_edited=&#8221;on|phone&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<ul>\n<li><span>Industry first<\/span><\/li>\n<li><span>300mm graphene synthesis equipment<\/span><br \/><span><\/span><\/li>\n<li><span>Transfer free &#8211; direct synthesis<\/span><br \/><span><\/span><\/li>\n<li><span>BEOL compatible low temperature process<\/span><\/li>\n<li><span>Industry standard interfaces<\/span><\/li>\n<li><span>Green<\/span><\/li>\n<\/ul>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8221;1&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; background_color=&#8221;rgba(0,0,0,0.03)&#8221; background_enable_pattern_style=&#8221;on&#8221; background_pattern_style=&#8221;honeycomb&#8221; background_pattern_color=&#8221;rgba(0,0,0,0.02)&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_row _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; header_2_font=&#8221;|600|||||||&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<h2>Other Applications<\/h2>\n<p>In addition to the transformative changes we envision by introducing a revolutionary interconnect technology paradigm for CMOS logic and memory, our CMOS-compatible graphene technology can also provide unique and smart solutions for:<\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8221;1_2,1_2&#8243; _builder_version=&#8221;4.18.0&#8243; 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