The semiconductor industry has hit a critical juncture with copper interconnects reaching their performance limits. Destination 2D, a startup led by a team of industry veterans and researchers, which has achieved a significant breakthrough by integrating graphene interconnects into CMOS-compatible semiconductor processes.
With its proprietary equipment, the CoolC GT300, and a series of patented techniques, the company has demonstrated wafer-scale synthesis of high-quality graphene under conditions suitable for mainstream semiconductor manufacturing.
The Limits of Copper and the Case for Graphene
For decades, copper has been the backbone of interconnect technology in microchips. However, as chip dimensions continue to shrink, copper’s resistivity has become a bottleneck, especially at sub-15 nm scales. Increased resistivity impacts power efficiency, performance, and reliability, making it increasingly untenable for modern designs like GPUs and CPUs.
Graphene offers a compelling alternative. This two-dimensional material, a single layer of carbon atoms arranged in a hexagonal lattice, is heralded for its remarkable electrical conductivity, tensile strength, and ultra-thin structure. Yet, its journey from theoretical potential to practical application in chipmaking has been fraught with challenges.
Traditional graphene synthesis methods, such as chemical vapor deposition, require high temperatures and cumbersome transfer processes, often leading to quality issues and compatibility concerns with CMOS processes. Addressing these challenges required a novel approach.
Inside Destination 2D’s Breakthrough
Destination 2D’s CTO, Prof. Dr. Kaustav Banerjee, a UC Santa Barbara professor and expert in graphene interconnect technology, has spearheaded the development of a patented pressure-assisted solid-phase diffusion method. This approach enables the direct synthesis of multilayer graphene onto wafer-scale dielectric substrates at CMOS-compatible temperatures.
The technique avoids the warping and cracking issues that have long hindered graphene’s adoption in semiconductor applications. By leveraging intercalation-doping and edge-contacted multilayer graphene, Destination 2D has achieved interconnects with significantly lower resistivity, improved reliability, and energy efficiency—reportedly up to 80% better than copper-based counterparts.
Central to the company’s success is the CoolC GT300, a specialized piece of equipment engineered for industrial-scale graphene synthesis. Designed by a team led by Dave Silvetti, Chief Product Officer and veteran of the semiconductor equipment industry, the CoolC GT300 makes graphene synthesis transfer-free and thermally stable, addressing key hurdles that had stymied previous attempts at commercialization.
Leadership Driving Innovation
Destination 2D was co-founded by Ravi Iyengar, a microprocessor design expert and serial entrepreneur, alongside Prof. Dr. Banerjee, whose groundbreaking research laid the foundation for the company’s graphene interconnect technology.
The startup’s Chief Scientist, Sir Konstantin Novoselov, adds further depth to the team. As a co-recipient of the 2010 Nobel Prize in Physics for graphene research, Novoselov’s expertise underscores Destination 2D’s leadership in this space.
Implications for Artificial Intelligence and High-Performance Computing
Destination 2D’s advancements have the potential to address pressing needs in compute-centric domains, including artificial intelligence and data-intensive applications. The compatibility of its graphene interconnect technology with both logic and memory chips opens doors for enhanced chip performance and energy efficiency.
“The successful demonstration of wafer-scale graphene synthesis using BEOL-compatible, low-temperature, transfer-free processes marks a pivotal moment for the CMOS industry,” said Iyengar.
Looking Ahead
Armed with a robust portfolio of patents and a team of seasoned experts, Destination 2D is set to challenge long-standing norms in semiconductor manufacturing. Its graphene interconnects, backed by industrial-scale synthesis capabilities, could redefine the benchmarks for performance and efficiency in chip design.
The company’s immediate focus includes the deployment of the CoolC GT300, now available for order, signaling its readiness to support customers seeking next-generation solutions for their interconnect needs.
As the semiconductor industry grapples with the limits of copper, Destination 2D’s approach offers a tangible pathway forward, grounded in rigorous science and engineered precision.